Benchmarking 3D-IC cooling; rad-hard flip-flops; high-speed data error correction. Researchers from Massachusetts Institute ...

Supply chain vulnerabilities, hardware attacks, and communications hacks are rife. Autonomous technology poses extra threats.

A new technical paper titled “Key Safety Design Overview in AI-driven Autonomous Vehicles” was published by researchers at ...

AI export rule to be scrapped; SEMI, EU request; Cadence, Nvidia supercomputer; AI co-processor; Imagination's new GPU; semi ...

A new technical paper titled “Hardware vs. Software Implementation of Warp-Level Features in Vortex RISC-V GPU” was published ...

Smartly designed metrology solutions delivering precise measurements enable manufacturers to maintain yield and productivity ...

Exploiting Exclusive System-Level Cache in Apple M-Series SoCs for Enhanced Cache Occupancy Attacks” was published by ...

Intel, TSMC, and Samsung are developing a broad set of technologies and relationships that will be required for the next generation of AI chips.

Innovations in semiconductor technology—such as advancements in AI high-performance computing (HPC), Angstrom-scale silicon ...

Rooting out the causes of silent data corruption errors will require testing improvements and much more. Silent data errors ...

Semiconductors designed for spacecraft face a range of extreme conditions that impact aging. A reliable source of power is ...

A new technical paper titled “Efficient Magnetization Switching via Orbital-to-Spin Conversion in Cr/W-Based Heterostructures ...